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Nestle, Session on New Tech, Special LCSA (TSCA) Meeting Added to RadTech 2018

Douglas Copen will be speaking on “Packaging Food Safety Concerns for Inks from a Brand Owner Perspective.”

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By: DAVID SAVASTANO

Editor, Ink World Magazine

Douglas Copen, senior packaging safety specialist with Nestle, has just been added to the Conference Program at RadTech 2018, May 7-9, in Chicago. Copen will be speaking on “Packaging Food Safety Concerns for Inks from a Brand Owner Perspective.” in a special EHS session taking place on Wednesday, May 9.   Also in the session, Lynn Bergeson of Bergeson & Campbell will present on “What RadTech Members Need to Know about New TSCA,” reviewing what has happened, what EPA is poised to do next, ...

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